Collaboration on Next-generation Spatial Computing
The author is an analyst of NH Investment & Securities. He can be reached at kyuha.lee@nhqv.com. -- Ed.
At IFA 2022, Qualcomm and Meta Platforms announced a multi-year agreement to work together on next-generation spatial computing technology. The ability to sense and process real-time spatial and user location information is to be critical in the XR industry. Related players are to reap mid/long-term benefits.
Qualcomm and Meta Platforms to collaborate on next-generation spatial computing
At IFA 2022, Qualcomm and Meta Platforms announced a multi-year agreement to work together on next-generation spatial computing technology, with Qualcomm to develop custom Snapdragon XR chipsets for Meta Quest hardware. Moving ahead, the ability to sense and process real-time spatial and user location information is to be critical within the XR industry.
We note that Qualcomm and Meta Platforms already have seven years of history working together for XR products, including the use of Qualcomm chipsets in Oculus VR devices.
To be released in Oct 2022, the Meta Quest Pro virtual reality headset is expected to stand out from existing XR devices thanks to its advanced spatial location data sensing and processing capabilities. The new device is to offer a total of 11 cameras (vs 4 for existing devices) and 12 GB of DRAM (vs 6 GB).
Ability to process real-time spatial and user location data to be critical
Apple is expected to go one step further than Meta Platforms by offering a product equipped with a high-performance chip dedicated to processing real-time spatial and user location data. Unlike Apple’s existing products, the new device is to come with a whopping 16GB of DRAM.
Going forward, we believe that demand for sensing components (camera and 3D sensing modules), high-performance semiconductor chip design/production, and high-performance substrates will rise in line with the expansion of real-time location information and spatial data processing capabilities. Related beneficiaries are to include Qualcomm, TSMC (high-performance semiconductors), Samsung Electro-Mechanics (high-performance substrates), Newflex (sensing components), and LG Innotek.