G Flex 2 Chips

LG G Flex 2 at CES 2015 in Las Vegas.
LG G Flex 2 at CES 2015 in Las Vegas.

 

SK Hynix is actively seeking to dominate the mobile memory semiconductor market. Its latest movie is to announce on Feb. 9 that LG Electronics features 8GB LPDDR4 in the G Flex 2.

The 20-nanometer-class mobile DRAM developed by SK Hynix in 2013 is twice as fast as existing products in data transmission speeds, and consumes 30 percent less electricity. 

The company has strengthened its cooperation with the Korean tech giant since 2014 to feature its ultra-fast and low-power mobile memory semiconductors in LG's mobile devices. The chipmaker has recently succeeded in commercializing 8GB LPDDR4 by linking its mobile DRAM with a system-on-a-chip (SoC), thereby achieving its goal of featuring its DRAM in the G Flex 2. 

Currently, SK Hynix is working to supply 8GB mobile DRAM to Apple and Chinese smartphone makers.

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