Importance of Post-processing Technology Increases
The author is an analyst of NH Investment & Securities. He can be reached at hwdoh@nhqv.com. -- Ed.
Apple uses a silicon interposer in its M1 Ultra processor to attach two dies. The related ecosystem is likely to expand, and the importance of back-end process technology is set to be further emphasized in the development of high-performance processors going forward.
Apple develops high-performance processor by attaching two dies
On Mar 9, Apple announced that it uses a silicon interposer in its M1 Ultra chip, which will be installed in high-end PCs and the Mac Studio. Silicon interposer is a high-performance intermediate substrate developed to reduce the difference between the fine circuit line width of a die and the wide line width of package substrate. Due to its high price, it is mainly used in high-performance processors for data centers developed by Nvidia and AMD.
Apple developed the M1 Ultra processor by connecting two M1 Max dies using a silicon interposer. The process is handled by TSMC. The two dies operate like one processor with minimal bandwidth drop, resulting in memory bandwidth of up to 800 GB/s. The new chip has 90% higher performance at the same wattage compared to the latest 16-core desktop PCs from competitors.
Importance of post-processing technology increases in development of high-performance processors
As Apple has now started to use silicon interposer, in addition to AMD and Nvidia, the related ecosystem is set to expand. A major manufacturer of silicon interposers is Japanese firm DNP (7912.JP). Meanwhile, SKC (011790.KS) is developing a glass substrate that can replace expensive silicon interposers.
In the recent development of high-performance processors, post-fab technologies such as 2.5D and 3D dies are becoming key. Foundry orders are also being determined by whether foundries have related back-end process technology. Taiwan’s TSMC and ASE, which have developed back-end technology for some time, stand out. This trend is likely to accelerate in the future. Latecomers will need to increase investment in developing back-end process technology and creating the ecosystem in addition to front-end technology represented by EUV.