Intel Renames Process Nodes
The author is an analyst of NH Investment & Securities. He can be reached at hwdoh@nhqv.com. -- Ed.
Intel has changed the name of its process nodes for marketing purposes. Mass production for SEC’s GAA process has been delayed. Despite intensifying foundry competition, TSMC is expected to maintain a process technology edge for the time being.
Intel renames process nodes
On Jul 27, Intel held an event and announced a new architecture roadmap and plans to retake the lead in process technology. First, the firm changed its node names, renaming its 10nm technology Intel 7 and 7nm technology Intel 4. The intention is to emphasize that TSMC and Samsung Electronics (SEC)' 7nm and 5nm processes are actually similar to Intel’s existing 10nm and 7nm processes. Based on actual pitch, TSMC and SEC’s node names were exaggerated, causing Intel to lag behind in terms of marketing.
Intel 4 is scheduled to be mass-produced from 2023 and it will be the first Intel process to utilize EUV technology. Intel 20A is scheduled for mass production from 2024 by applying next-generation architecture named RibbonFET (GAA). Intel 18A is planned for mass production from 2025 and will feature second generation RibbonFET technology. If this technology roadmap progresses smoothly, Intel could gain a technological edge over TSMC from 2025.
Delayed mass production of SEC’s GAA
Intel also updated its packaging technology. The firm will adopt hybrid bonding for Foveros Direct, with mass production scheduled for 2023. Of note, TSMC will start mass production of AMD processors with hybrid bonding technology from end-2021.
Meanwhile, SEC has removed 3nm GAE (Gate-All-Around Early), which was scheduled for mass production in 2022, from its publicly disclosed technology roadmap. It is presumed that the process will not be provided to external customers and will only be used by the company's System LSI division. Also, according to the firm’s roadmap, it will provide a 4nm FinFET process to external customers from 2022 and a 3nm GAP (Gate-All-Around Plus) process from 2023. We believe that SEC’s GAA mass production has been delayed compared to its previous plan. For the time being, TSMC is expected to maintain the lead in logic and foundry processes.