Samsung Group’s electronics affiliates are joining forces to expedite the commercialization of glass substrates, a material used in semiconductor packaging, by establishing a united front for joint research and development (R&D). This strategy aims to achieve commercialization faster than semiconductor rival Intel, which entered glass substrate R&D a decade ago.
According to industry sources on March 12, Samsung Electro-Mechanics has embarked on joint R&D for glass substrates with major group affiliates such as Samsung Electronics and Samsung Display.
Samsung Electronics is expected to contribute its expertise in combining semiconductors with substrates, while Samsung Display will handle aspects related to glass processing. This marks the first time Samsung Electro-Mechanics is known to be conducting glass substrate research in collaboration with electronics component affiliates like Samsung Electronics and Samsung Display.
Samsung’s formation of an affiliate alliance for semiconductor glass substrate R&D is based on the potential impact this product could have on flipping the AI semiconductor industry landscape. Glass substrates could emerge as a “game changer” capable of altering the semiconductor market dynamics. The market competition, previously centered around processes, is expected to extend into the materials domain.
In the semiconductor market, the limits of microfabrication processes have recently become apparent, making advanced packaging technologies critical. The issue is that the traditional plastic substrates and silicon interposers used in packaging have reached their limitations. Plastic substrates have a rough surface, making it difficult to etch thin circuits on them, and their susceptibility to heat can cause warping when chips are bonded with heat. Silicon interposers compensate for the shortcomings of plastic substrates but require expensive equipment for the pre-process, significantly increasing costs.
Glass substrates overcome these drawbacks. They are more heat-resistant than plastic, less prone to warping during processing, and have a flat surface, facilitating the etching of fine circuits. They offer an optimal solution for combining multiple, high-performance chips on a larger area than current substrates.
The potential of glass substrates has prompted a global race for technology acquisition, with Intel as a notable example. In September last year, Intel announced plans to mass-produce glass substrates by around 2030. The company has invested approximately US$1 billion over the past decade to establish a glass substrate R&D line and supply chain at its Arizona plant. Intel is also known to be working towards commercializing glass substrates in collaboration with renowned glass processing company LPKF and German glass company Schott. Notably, in the United States, home to Intel’s headquarters, Penn State University leads a national effort, with over ten prestigious universities and materials, parts, and equipment companies collaborating on glass substrate research. Apple is also exploring the integration of glass substrates into electronic devices, indicating that glass substrates could be widely used not only in large-area chips but also in mobile devices if Apple chooses this material.
Ibiden, the world’s leading semiconductor substrate manufacturer based in Japan, announced in October last year that it has identified glass substrates as a new business venture and has embarked on R&D. In South Korea, SK Group affiliate SKC has established a subsidiary, Absolics, to explore mass production of substrates with leading semiconductor companies, including AMD.
Samsung Electro-Mechanics officially announced plans to mass-produce glass substrates by 2026, a timeline four years ahead of Intel’s target for chip production application in 2030. Samsung Electro-Mechanics is expected to move closer to this goal by maximizing R&D synergies with the alliance of Samsung Electronics and Samsung Display.