U.S. President Joe Biden smiles in the Roosevelt Room of the White House as he listens to a presentation by Chey Tae-won, the chairman of SK Group, via video on July 26, 2023.
SK hynix is contemplating the establishment of a semiconductor packaging plant in the United States.
According to multiple foreign news outlets on Feb. 1, SK hynix plans to build a semiconductor packaging factory in Indiana. It is anticipated that the SK hynix packaging plant will specialize in High Bandwidth Memory (HBM).
Until now, HBM produced by SK hynix in Korea has been used in the Graphics Processing Units (GPUs) of Nvidia, a U.S.-based company.
Industry insiders believe that the establishment of the SK hynix plant in Indiana will enable Nvidia to source components within the United States. If SK hynix produces HBM in the U.S., it will be possible to manufacture Artificial Intelligence chips using only parts produced in the country.
Reuters and other foreign media reported that the factory’s funding would be covered by the US$22 billion investment announced by Chey Tae-won, the chairman of SK Group, during a video meeting with President Joe Biden in 2022.
SK hynix has been reticent about its official decision on the investment in the U.S.