SK hynix has announced plans to release its 5th generation High Bandwidth Memory (HBM), named HBM3E, this year, and aims to launch HBM4 by 2026.
Kim Chun-hwan, vice president of SK hynix, revealed these plans during his keynote speech at SEMICON Korea 2024, held at COEX in the Samseong neighborhood of Seoul on on Jan. 31.
Vice President Kim stated, “With the advent of the AI computing era, generative AI is rapidly advancing,” adding, “The generative AI market is expected to grow at an annual rate of 35%.” He further commented that the semiconductor industry would face intense survival competition this year to meet the increasing demand and customer needs for memory.
SK hynix, a leading company in the HBM market essential for AI semiconductors, is currently mass-producing the highest specification HBM3 and plans to introduce HBM3E in the first half of this year. The company has set a target to mass-produce HBM4 by 2026. Kim projected that the HBM market would grow by 40% by 2025.
Kim also detailed specific trends in DRAM and NAND flash. He mentioned, “We are currently mass-producing 1b-level products and developing 1c. However, we anticipate severe technological limitations below the 10-nanometer level.” Due to these challenges, companies are fervently pursuing the development of new materials and structures. The current 1b circuit line width, which is the industry’s cutting edge, is at the 12-nanometer level. 1c represents the next generation.
Samsung Electronics also expressed its determination to regain its status as a memory powerhouse by enhancing its competitiveness in the HBM business.
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Kim Jae-joon, vice president of Samsung Electronics’ Memory Business Division, stated during the fourth quarter earnings conference call on Jan. 31, “The next-generation HBM3E project is progressing as planned, with 8-layer sample products currently being supplied to clients. Mass production is expected to be ready within the first half of this year. HBM4 development targets sampling in 2025 and mass production in 2026.”
He added, “With the increase in the proportion of advanced products such as HBM3 and HBM3E, their share in sales volume has exceeded 50% and is expected to reach 90% by the second half of this year.” Samsung Electronics particularly plans to strengthen its custom HBM business tailored for customers.
Vice President Kim said, “In a situation where demand for custom HBM is increasing along with the growth of generative AI, we are developing custom HBM products optimized for individual customers, which not only meet the standard specifications but also include logic chips.” He continued, “We are currently discussing detailed specifications with key clients. In the custom HBM market, where collaboration with system semiconductors is crucial, we aim to lead the industry competitively by creating synergy with the foundry, system LSI, and advanced packaging teams.”