At the beginning of this year, the Consumer Electronics Show (CES) 2024, the world’s largest consumer electronics and IT exhibition, brought into focus the trend of “on-device AI,” or artificial intelligence operating within the device. The emergence of devices equipped with this technology is injecting vigor into the semiconductor industry.
According to industry sources on Jan. 28, Samsung Electronics plans to unveil a series of products, including AI-enhanced TVs and refrigerators, following the official release of the AI smartphone Galaxy S24 series on Jan. 31. The Galaxy S24 set a new record for pre-orders, reaching 1.21 million units within a week of its announcement on Jan. 25.
In response, competitors are also preparing to launch new products featuring AI capabilities within the device. Chinese companies Huawei, Vivo, Oppo, Xiaomi, and American Motorola are gearing up to release on-device AI phones. Apple is also rumored to incorporate AI into its new iPhone model slated for release in the latter half of the year.
LG Electronics has recently launched the 2024 model LG Whisen Objet Collection Tower air conditioner with enhanced AI capabilities. The product automatically adjusts the direction and strength of the airflow based on real-time detection of the user’s location, eliminating the need for manual control.
This year, various devices, including PCs, automobiles, and healthcare equipment, are expected to be equipped with AI chips.
Consequently, Samsung Electronics anticipates increasing the sales proportion of high-value products in both system semiconductors and memory semiconductors. The company is looking forward to expanding sales of high-performance, low-power on-device AI DRAM solutions, including mobile DRAM LPDDR5X, LPDDR5X-based memory modules LPPDR5X CAMM2, and LLW (Low Latency Wide) DRAM.
SK hynix is also making strides in the field of AI server high-bandwidth memory (HBM). They are working on developing high-performance mobile modules for on-device AI, known as LPCAMM2. Additionally, the company plans to double its production capacity for Silicon Via (TSV), essential for HBM production, as part of its investment to meet the growing demand for AI.
Kim Gyu-hyeon, head of DRAM Marketing at SK hynix, explained during the earnings conference call on the 25th that “AI PCs require at least double the DRAM capacity compared to conventional PCs, and AI smartphones need a minimum of 4GB more DRAM than regular smartphones.”