A graphic advertising Samsung Memory Tech Day 2023
A graphic advertising Samsung Memory Tech Day 2023

Samsung Electronics hosted the “Samsung Memory Tech Day 2023” on Oct. 20 (local time) at the McEnery Convention Center located in the Silicon Valley. At the event, Samsung showcased several groundbreaking memory solutions, including: the ultra-high-performance HBM3E DRAM Shinebolt, leading the innovation in AI technology; LPDDR5X CAMM2 that is set to redefine the landscape of next-generation PC and laptop DRAM markets; Detachable AutoSSD, a vehicle-oriented SSD that allows partitioned use through storage virtualization.

Lee Jung-bae, president of the Samsung Electronics Memory Business, revealed that since initiating the production of 12-nanometer (nm) DRAM in May, the company is currently developing next-generation 11-nm DRAM, targeting the industry’s highest level of integration. Samsung is preparing to introduce a 3D new structure for sub-10-nm DRAM, with plans to expand its capacity to more than 100 gigabits (Gb) on a single chip.

Samsung also unveiled its next-generation HBM3E DRAM, Shinebolt, for the first time. Shinebolt delivers a high-performance rate of up to 9.8 Gbps per data input/output pin, which translates to processing speeds of over 1.2 TB per second. Samsung explained that they achieve flawless layering by filling gaps between chips using optimized non-conductive film (NCF) technology, which also enhances its thermal properties.

Samsung is currently mass-producing 8-layer and 12-layer HBM3 products and has begun delivering samples of the next-generation HBM3E to customers. They had previously revealed plans to develop the 6th generation HBM product, HBM4, by 2025.

On Oct. 5, Samsung also introduced its new application processor (AP), the Exynos 2400 at Samsung System LSI Tech Day 2023 held in Silicon Valley. The Exynos 2400 showcases a 1.7 times increase in Central Processing Unit (CPU) performance and a whopping 14.7 times increase in AI performance compared to its predecessor, the Exynos 2200. The industry is keenly watching to see if this chip will be incorporated into upcoming products like the Galaxy S24, set to launch next year.

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