HANMI Semiconductor Starts Full Operation of ‘Bonder Factory’

HANMI Semiconductor announced on Aug. 2 that it has commenced operation of the “Bonder Factory” to enhance the production capacity of the Dual TC Bonder, an essential piece of equipment for the production process of AI semiconductor wideband memory (HBM).

The Bonder Factory has been established in Plant 3 of HANMI Semiconductor’s five factories spanning approximately 79,000 square meters. Plant 3 is a large clean room capable of assembling and testing over 50 semiconductor devices at once. It provides the optimal environment for the production of the Dual TC Bonder, TC Bonder, and Flip Chip Bonder.

The TC Bonder of HANMI Semiconductor is equipment used to vertically stack and attach semiconductor chips made with Through-Silicon Via (TSV) technology. The term TC Bonder is used because it implements a Thermal Compression method. It is considered an essential piece of equipment in the HBM era.

A HANMI Semiconductor official said, “As the global semiconductor market is expected to recover in the second half of this year after hitting a low point, we’ve worked to stay a step ahead in production capabilities to meet changing market demand, considering that major global companies producing AI semiconductors are our key customers.”