Reiterating the Positives

Samsung Electronics’ Icebolt third-generation high bandwidth memory product

“The market share of Samsung’s high-bandwidth memory (HBM) products is still over 50 percent,” said Kyung Kye-hyun, president of Samsung Electronics’ DS division in charge of the semiconductor business, dismissing concerns that the company’s memory competitiveness is declining. It took place during an internal communication event with employees held every Wednesday on July 5.

This differs from TrendForce’s forecast that SK hynix, Samsung Electronics, and Micron will take 53 percent, 38 percent, and 9 percent shares of the global HBM market in 2023, respectively. “Recently, our HBM3 products have been evaluated as excellent by our customers,” said Kyung. “We believe that HBM3 and HBM3P will contribute to ramping up the DS division’s profits next year.”

According to industry sources, Samsung HBM products went into supercomputers such as Intel’s Aurora Project and AMD’s El Capitan at Lawrence Livermore National Laboratory in the United States along with AMD’s MI300 AI superchip.

“Some analysts say Samsung will be rewarded for its investment in semiconductors at a time the semiconductor market was deflating if the memory sector recovers thanks to an AI craze,” the New York Times recently reported. “But skeptics question whether the Korean chipmaker will be able to play as essential a role in generative AI as it has in the smartphone and high-resolution TV sectors. In fact, in 2022, Nvidia chose SK hynix as its HBM supplier.”

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