160 Tril. Won to Be Invested in 29 New Fabs in 2021-2022

 

Semiconductor Equipment and Materials International (SEMI) said in its report on June 22 that the construction of 19 and 10 fabs would commence this year and next year, respectively. “A semiconductor equipment investment of more than 160 trillion won is expected to be made in relation to the construction,” it said.

The 29 are divided into eight in China, eight in Taiwan, six in North America, three in Europe and the Middle East, two in Japan and two in South Korea. As for 12-inch wafer fabs, construction will commence at 15 and seven sites this year and next year, respectively.

The other seven fabs will produce four-, six- and eight-inch wafers. The monthly production capacity of the 29 fabs is expected to amount to 2.6 million 200 mm wafers. The 29 fabs include 15 foundry fabs ranging from 30,000 to 220,000 in monthly capacity. The rest includes four memory fabs ranging from 100,000 to 400,000 in monthly capacity.

In most cases, it takes two years between fab construction commencement and semiconductor equipment installation. Most of the 29 sites are likely to be equipment-less until 2023. Equipment installation at the other sites is expected to start in the first half of 2022.

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