Hyundai Motor Group to Invest 100 Tril. Won in Future Mobility
Samsung Electronics has successfully developed the industry’s first 3-nanometer (nm) chip manufacturing technology. This achievement is expected to help the company attain its “Semiconductor Vision 2030,” a plan to become the No. 1 in system semiconductors as well as in memory chips by 2030.
In the meantime, Hyundai Motor Group announced on Jan. 2 that it will invest 100 trillion won (US$86 billion) by 2025 to establish leadership in the future mobility market.
Samsung Electronics vice chairman Lee Jae-yong visited a semiconductor research center in Hwaseong, Gyeonggi Province on Jan. 2, to be briefed on the successful development of the industry’s first 3-nm microfabrication technology. Lee discussed strategies for next-generation semiconductors with presidents of its device solutions (DS) sector.
Compared to 5-nm products for which Samsung Electronics has recently completed a manufacturing process, 3-nm semiconductors are 35 percent smaller in chip size, consume 50 percent less power, but shows a 30 percent better performance. The top chipmaker plans to start mass production of chips using the 3-nm process in 2022.
On the same day, Chung Eui-sun, executive vice president of Hyundai Motor Group, unveiled the group’s investment scheme in his New Year’s address. “We aim to expand our global presence in electric vehicle (EV) markets by developing EV platforms and strengthening the competitiveness of key EV parts,” he said, adding that the group is planning to launch a total of 44 electrified vehicles, including 11 EVs by 2025.