A Substrate for High-performance Processors

Samsung Electro-Mechanics is reportedly pushing to supply flip-chip-ball grid array (FC-BGA) substrates for Apple’s next-generation PC processor M2.

Samsung Electro-Mechanics is reportedly pushing to supply flip-chip-ball grid array (FC-BGA) substrates for Apple’s next-generation PC processor M2.

The company is in talks with Apple regarding the development of the M2 processor. Apple is currently developing new MacBook products equipped with the M2 processor. Samsung Electro-Mechanics is developing a semiconductor package board in line with Apple’s release schedule for new products.

Flip-chip-ball grid array (FC-BGA) substrates are a highly integrated semiconductor package substrate with the highest manufacturing difficulty. They are used for central processing units (CPUs) and graphic processing units (GPUs) that require high-density circuit connections.

Previously, Samsung Electro-Mechanics provided Apple with FC-BGA substrates for the PC processor M1, which was unveiled in 2020.

Samsung Electro-Mechanics invested 1.3 trillion won to build FC-BGA production facilities in Vietnam in December 2021. In March, it invested an additional 300 billion won to expand its FC-BGA plant in Busan, Korea.


“We cannot confirm the contents related to our customer,” Samsung Electro-Mechanics said with respect to the supply of semiconductor package substrates to Apple.

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