Overheating Problem

Qualcomm’s Snapdragon system-on-chip application processor is designed to be used in smartphones, tablets, and smartbook devices.
Qualcomm’s Snapdragon system-on-chip application processor is designed to be used in smartphones, tablets, and smartbook devices.

 

Qualcomm has reportedly decided to redesign its own application processor (AP), the Snapdragon 810, which is embroiled in an overheating controversy. Therefore, the industry is paying attention to whether or not Samsung Electronics will feature its own AP in the Galaxy S6.

According to major overseas media outlets on Jan. 26, Qualcomm recently started work to solve the overheating problem of the Snapdragon 810.

The world's number one AP maker is said to be planning to address the problem by March at the latest, which is aimed at meeting the launch date of the Galaxy S6.

Samsung primarily uses the Snapdragon series in its Galaxy S models, which accounts for 12 percent of Qualcomm's total yearly sales.

However, the Korean Android phone maker is planning to hold a launch event for the Galaxy S6 at the MWC 2015 to be held in March, and to release the model worldwide following the event. Hence, many in the industry are saying that the Snapdragon 810 will be unlikely to be used in the new phone. Even though Qualcomm is Samsung's major business partner, it is not necessary for the Korean firm to postpone the launch date of its flagship model in order to use defective semiconductor chips.

On top of that, Samsung has already developed its own Exynos chips. Some believe that it is possible for the firm to use Exynos chips in the Galaxy S6 to increase its share of the global AP market from the current 5 percent level.

The overheating problem of the Snapdragon 810 has consistently been raised from late last year.

Some foreign news organizations recently reported that Samsung decided not to use Qualcomm's chips in the Galaxy S6, but representatives from both companies said that it had not yet been decided.

LG Electronics, on the other hand, featured the controversial chips in the G Flex 2 for the first time, which is scheduled to be introduced to the nation late this month.

“We did not find any problem with the Snapdragon 810,” said a LG official during a launch event for the G Flex 2 held on Jan. 22. The official added, “The level of overheating is determined by the CPU of the phone. But the product's cooling design or CPU optimization also decides the level. The G Flex 2 is designed to cool itself at an optimal level.”

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