The iPhone 6 unveiled by Apple on Sept. 9 (local time) includes a large number of core components, including application processors (APs), DRAM, and camera modules, made by Korean companies like Samsung and LG Electronics.
According to industry sources on Sept. 10, the new iPhone is fitted with the new A8 AP built using a 20nm process. As a chip that operates applications, an AP is a core component that plays an important part in a smartphone.
The width between circuit lines for the A8 chip is 20nm, much smaller than the 28nm class A7. Previously, Apple commissioned Taiwan Semiconductor Manufacturing Company to produce the A7 chip, but Samsung was reportedly assigned to manufacture the A8 processor. Experts are saying that the Korean tech company's technical skills to mass-produce 20 nm class APs in a steady fashion were reflected in Apple's decision.
DRAM featured in the iPhone 5 was made by SK Hynix and Micron Technology. However, with Chinese smartphone makers like Xiaomi Tech and Lenovo recently entering the market, the demand for mobile DRAM rose rapidly.
As a result, Apple signed a contract with Samsung for DRAM supply once again, two years after its initial agreement. Thus, the number of DRAM manufacturers for the iPhone 6 increased.
The 4.7 inch iPhone 6 and the 5.5 inch iPhone 6 Plus also come with higher resolution Retina HD displays.
The LCD–based Retina display is mainly produced by LG Display and Japan Display. Taiwanese AU Optronics and Chinese LCD maker BOE reportedly started to mass produce the Retina display, but it is not clear whether or not they actually entered into a contract with Apple.
The iPhone 6 Plus sports an 8 megapixel iSight camera with optical image stabilization. The camera module was reportedly manufactured by LG Innotek.
Apple is also said to have contracted with LG Innotek to supply a large number of printed circuit boards to connect the components within their devices.