To Create Synergies with Japanese Materials Companies
The author is an analyst of NH Investment & Securities. He can be reached at hwdoh@nhqv.com. -- Ed.
TSMC plans to create synergies with a range of companies via the establishment of a Japanese research institute for development of materials for 3D SoIC packaging in Japan. TSMC is emphasizing that 3D SoIC will be one of the main growth engines from 2022.
TSMC invests in Japan for 3D SoIC materials development
TSMC’s Japan research center (being established with investment of JPY18.6bn) is to focus on the development of 3D SoIC materials. In detail, the venture aims to create synergies with a range of Japanese materials companies via the establishment of a Japanese research institute for advanced materials technology. Presenting 3D SoIC as one of the main growth engines to be in play from 2022, TSMC is constructing two back-end process fabs for 3D SoIC technology, one of which is to be completed in 2H21.
TSMC’s 3D SoIC is based on the ‘hybrid bonding’ back-end process. Through hybrid bonding, it is possible to implement a bonding pitch of 10µm or less (around one-quarter that of the previous gen technology). Such pitch sizes allow for 20x greater energy efficiency and 10x faster communication speeds between semiconductors (vs earlier technologies).
Related plays: Hanmi Semiconductor, Park Systems, EO Technics
Hybrid bonding forms electrodes by etching via patterns on a wafer and depositing copper. Two dies are bonded together to form a 3D package through the exposed copper electrode on the measured wafer. In addition to TSMC, Intel and Samsung Electronics are developing related technologies. It is expected that 3D back-end process investment will accelerate in the future. Related domestic equipment manufacturers include Hanmi Semiconductor, Park Systems, and EO Technics.
Meanwhile, ASM Pacific Technology and EV Group (EVG) have signed a contract for joint development of die-wafer hybrid bonding technology. In detail, ASM is developing technology for die bonding, and EVG is developing technology for die-to-wafer bonding. Due to the nature of hybrid bonding technology, collaboration among companies operating in diverse arenas such as front-end process, back-end process, equipment manufacturing, and packaging becomes increasingly important.