Reduces High-frequency Power Noise
Samsung Electro-Mechanics announced on Jan. 20 that it has developed a 0.65 mm ultra-slim 3-socket MLCC, which is 18 percent thinner than previous products, and began supplying them to global smartphone companies.
MLCC is a core component of electric devices that controls the stable flow of current within electric product circuits. A 3-socket MLCC has one additional earth socket compared with the general MLCC and allows for easy reduction in high-frequency power noise.
Demand for slimmer, multi-functional and high-performance components has been growing with the increase in the number of components and reduction in thickness of recent smartphones.
The slim 3-socket MLCC is the thinnest among 1209-size 3-socket MLCCs. Previous products had a width of 0.8 mm due to limitations in minimizing the internal dielectric layer. Samsung Electro-Mechanics increased the freedom of smartphone design by reducing the previous thickness by 18 percent by applying independent thin layer molding technology and superfine dielectric layer.
The new product efficiently removes high-frequency noise occurring from the application processor (AP) power unit, and it has increased internal space efficiency by replacing 3 to 4 general MLCCs.
Kim Doo-young, Head of the Component Unit at Samsung Electro-Mechanics, said, “There has been a massive increase in demand for miniature, high-performance, and highly-reliable MLCCs with the commercialization of 5G mobile communication and electrification of automobiles. Samsung Electro-Mechanics will secure a leading position in the market by strengthening its distinctive technology, including the internal development of core materials and internalization of equipment, and manufacturing capabilities.”