With Technical Support from KEIT

An ultra-low-power 5G communication semiconductor from Zaram Technology

A Korean electronic parts producer has successfully commercialized an ultra-low power semiconductor for 5G telecommunications with technological support from the Korea Evaluation Institute of Industrial Technology (KEIT), the state-run R&D institute said on June 24.

Zaram Technology, a small and medium-sized parts manufacturer, has commercialized a low-power semiconductor that can drastically increase 5G networks’ coverage. The semiconductor consumes far less power than existing chips, while meeting the standards set by the International Telecommunication Union (ITU).

The company has started mass-producing ZARAM XGSPON STICK, a 10-Gigabit-capable symmetric passive optical network (XGSPON) stick type terminal.

A stick embedded with this chip is a key component of 5G networks. It is compatible with standard equipment (SFF-8431) because it satisfies power consumption standards.

Zaram Technology has completed compatibility verification with global telecommunication equipment companies and signed a contract to export XGSPON Stick to Nokia.

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