A 5G smartphones loaded with SK Hynix's 128-layer one-terabyte 4D NAND flash is expected to come out in the second half of next year.
SK Hynix announced on Nov. 20 that it has delivered engineering samples of “1TB UFS 3.1,” a 128-layer NAND-based mobile solution, to major smartphone manufacturers. 1TB UFS 3.1 is an optimized solution for ultra-thin 5G smartphones, said an SK Hynix official. "A smartphone loaded with this product will be produced in the second half of next year."
Announcing the industry's first development of the 128-layer 4D NAND in June, SK Hynix said it would launch a solution for smartphones using this technology. The company’s solution allows a smartphone maker to produce a slim phone as it halves the number of chips required compared to using a 512Gb NAND flash.
The new product will help SK Hynix respond to the expansion of the 5G smartphone market better.