Samsung Electronics unveiled next-generation semiconductor products and latest technologies at its annual tech day event held at Silicon Valleyin the United States on Oct. 23 (local time).
The world’s largest chipmaker presented its ambitious plan to jump far ahead of its rivals in system and memory conductor sectors. It introduced its next-generation mobile application processor (AP) “Exynos 990” and high-performance memory product “7th-generation V-NAND.”
Samsung Tech Day is an annual event at which the company showcases its latest semiconductor technologies. This year marked the third time.
Samsung introduced high-performance mobile AP Exynos 990, which delivers enhanced operating performance with a dual-core neural processing unit (NPU). The Exynos 990 has AI powered operating capability that can perform 10 trillion operations per second, which allows smartphone users to utilize a variety of AI applications including object detection, voice recognition, deep learning, and intelligent cameras. The new processor increases power efficiency compared to Samsung’s previous premium mobile APs by 20 percent and graphical performance by up to 20 percent. Industry experts speculate that the Exynos 990 will be applied to flagship smartphone devices that Samsung will release next year.
Samsung also debuted a new 5G solution product, the Exynos modem 5123. Both Exynos 990 and Exynos modem 5123 are built on a 7 nanometer (nm) process using extreme ultraviolet (EUV) lithography.
In the memory sector, 7th-generation V-NAND technology catches great attention. Samsung already produced 6th-generation V-NAND products and advanced solid-state drives (SSDs) last July, using one stack technology that involves stacking more than 100 layers of memory cells in a structure. At the event of 2019, the company made public the 7th-generation V-NAND technology, making it possible to double the power and performance compared to its predecessor. The memory supplier is planning to release 7th-generation V-NAND products next year.
Samsung also announced third-generation 10nm-class (1z-nm) DRAM, PCIe Gen5 SSD and 12GB uMCP and other new products using next-generation technologies, along with their commercialization strategies. “Samsung is committed to opening new possibilities in future information technology (IT) as a whole with the help of next-generation semiconductor solutions optimized to fast-moving market trends like AI, 5G, cloud, edge computing, automotive vehicles,” said Choi Joo-sun, vice president of Samsung Electronics North America.