On November 20 Korea’s second largest chip maker SK Hynix unveiled that it has started mass production of 64 gigabit multi-level cell NAND flash memory chips utilizing the thinnest processing technology in the industry.
The chipmaker has mass-produced its first version of world’s first 16 nanometer NAND flash chips since June this year, and recently started to mass produce the smaller-sized second version.
The thinner process technology reduces chips, the more frequent interference among cells occurs. SK Hynix applied its "Air-Gap" technology to overcome interference among the cells. Air-Gap is an insulation shield with vacuum holes between circuits, not with insulating substances.
An official of SK Hynix said that the company will strengthen its competitiveness in NAND flash solutions while accelerating the development of the triple level cell (TLC) and 3D NAND flash.