The Foundry Division of Samsung Electronics will mass-produce the Snapdragon 845 chipset, the next-generation mobile AP of Qualcomm.
"We are looking forward to a new Snapdragon product. Samsung will continue to strengthen cooperation with Qualcomm," said Jung Eun-seung, president and head of the Foundry Business at Samsung Electronics in a keynote speech at the 2017 Qualcomm Snapdragon Technology Summit held in Maui, Hawaii on December 5 (local time).
"Qualcomm and Samsung Electronics have been a foundry partner for mobile platforms over the last 10 years," said Jung. "We want continued cooperation with Qualcomm."
"The Foundry Division of Samsung Electronics will continue to work with Qualcomm to reduce power consumption and improve process technology performance," he added. "We look forward to the success of Snapdragon 845 next year."
The industry’s prospects for the mass-producer of Qualcomm Snapdragon 845 mass production were divided between Taiwan’s TSMC and Korea’s Samsung Electronics. However, Jung's visit to the Qualcomm event hints that Samsung Electronics will roll out Snapdragon 845 Chip.
Samsung Electronics is aiming to accelerate the development of under-10nm micro-processes and joined the group of the top two in the global foundry market next year by way of partnering with Qualcomm. Earlier, Samsung said that the company was working with Qualcomm to develop an 8nm process, following 14nm and 10nm processes.
In reference with this, Samsung Electronics began mass-production of 2nd-generation 10nm micro-processing last month. Qualcomm's Snapdragon 845 Chipset is currently rolling out through this process.
The industry expects that if Samsung's Foundry Division mass-produces Snapdragon 845 Chipset, the chipset will exclusively go into the Galaxy S9 which will be launch early next year.