Samsung Electronics Co., a world leader in advanced semiconductor technology, announced on August 30 that it has begun mass production of Exynos 7570, the company’s newest low-end mobile application processor (AP), built on 14-nanometer (nm) FinFET process, integrating modem and connectivity solutions, for the first time in the industry.
The South Korean tech giant used the 14-nm process for the first time in the industry to mass produce premium mobile APs last year and low-end products earlier this year, strengthening the leadership in advanced process technology.
Samsung Electronics said the new Exynos 7570 gives it a full lineup for 14-nm products for the low-ends and said will allow it to provide smartphones and Internet of Things devices with high-performance and energy efficient solutions.
The quad-core Exynos 7570 has a CPU 70 percent more powerful than its 28-nm predecessor, and is 30 percent more energy efficient. It is also the first Exynos processor to fully integrate a Cat.4 LTE two-channel carrier aggregation (2CA) modem and connectivity solutions including WiFi, Bluetooth, frequency modulation (FM) radio and global navigation satellite system (GNSS) in one chip.
The chip supports Full HD video filming and playback, WXGA resolution, 8 megapixel and 13 megapixel front and back cameras and improved image signal processor (ISP), helping low-end smartphone users to enjoy high-resolution and high-specification contents more easily.
In addition, with design optimization and feature consolidation for components such as power management IC (PMICs) and radio frequency (RF) functionalities, Exynos 7570 reduces the total chipset size by up to 20 percent, allowing manufacturers to slim down design.