Chemical Mechanical Polishing

 

SKC is strengthening its business ability further on high value-added materials based on semiconductors. With a synergy with other subsidiaries, including SK Hynix, the company aims to increase the sales percentage of specialty products to one third of total sales.

SKC announced on Sept. 17 that it signed an asset purchase agreement with Dongsung A&T Co. for patents and business rights for chemical mechanical polishing (CMP) pads, entering the CMP pad business of semiconductor wafers. The two companies did not disclose the exact amount of the contract.

A CMP polishing pad is a polyurethane product designed for polishing and flattening the surface of semiconductor wafers. Since it is difficult for a company to tap into the market due to patent issues, the Dow Chemical Co., an American multinational chemical corporation, has accounted for more than 80 percent of the global market until now. The global market is estimated at 1 trillion won (US$856.53 million), while the domestic market is worth 200 billion won (US$171.31 million).

With the agreement, SKC has settled patent problems, which have been the entry barrier, and secured the complete manufacturing system from materials to product production. The company said that it already has the production technology and development ability for polyurethane products with its 30 years of experience so it can maximize synergy effects. SKC is also planning to tap into the market of CMP slurry, which is being used in CMP processing.

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