Asia's Largest Electronics Industry Exhibition
Doosan Corp. will showcase its electronics products at NEPCON JAPAN 2023 to be held at Tokyo Big Sight, Japan from Jan. 25 to 27, the company announced on Jan. 25.
Doosan will introduce its flagship copper clad laminate (CCL) product line and new products such as PFC, 5G antenna modules, and microelectromechanical system oscillators (MEMS oscillators).
CCL is formed by lamination of copper foil onto both sides of resin impregnated glass fabric sheets. The performance of CCL and a printed circuit board (PCB) is determined by the mixing ratio of resin. The company has managed to discover a mixing ratio that produces an overwhelming performance based on its experiences for the past 50 years.
Last year, Doosan developed polytetrafluoroethylene (PTFE) resin material. PTFE resin is an insulating layer with ultra-low loss characteristics. Recently, it is mainly applied to special fields such as space and aviation. When used in CCL for communication network boards, PTFE resin can respond to demand for high-end products such as mmWave and 6G products.
Doosan will also showcase PFC, a material that connects cells, the smallest unit of an electric vehicle battery, and can be extended to doors, seats, and roof cables, 5G antenna modules for the 28GHz, 26GHz, 39GHz, 28GHz, 26GHz and 39GHz frequency bands), a core part for communication devices such as 5G wireless repeaters and small cells and an MEMS oscillator with excellent frequency stability which generate two frequencies for the first time in the world.